Huge on-chip eDRAM L3. – 6x latency improvement. – No off-chip signaling rqmt. – 8x bandwidth improvement. – 3x less area than SRAM. – 5x less energy than. In a previous Power8 article, the performance and scaling benefits of IBM’s eDRAM capability were mentioned. One thing that should be stated. IBM Corp. took another step toward embedded DRAM and away from SRAM at ISSCC this week, pushing eDRAM as the technology to take over the SRAM.

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In this 14nm process IBM switched to a FinFET from a planar transistor which introduces a new set of challenges since they now have to connect to a thin fin meaning the strap size is also reduced meaning resistivity becomes a more profound problem.

Incorporating both logic and DRAM on one silicon die and getting both to work well is a challenge. Using a technique such as reactive-ion etching you form a deep trench.

Help us fix it! Why Chips Die Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely. This name will be displayed publicly. Connection to Network Management Network Ecram traditionally deals with extremely highly threaded workloads.

Figure 3 also shows a picture of the metal-insulator-metal MIM structure of the capacitor for the bit cell. IBM has been using DT structures for four generations now since their 45nm node and have since gained significant know-how working with DT structures and testing them.

I would expect that engineers tuned Power for the Database market. I wonder what the ratio of performance hit to reduction in latency was in moving to eDRAM? Posted by David at 9: Hybrid Memory Ed Ubm.

A rough diagram is shown below. After that, the low-resistivity titanium nitride TiN conformal layer is added. Spelling error report The following text will be sent to our editors: October 29, 2 Comments.


Fab Equipment Challenges For Logic is strong, memory is weak, and uncertainty in China could affect demand. Figure 2 shows a layout diagram for the companion Centaur memory buffer chip.

Since this eliminates the need for the sidewall nitride spacer they have always used previously in order to protect the BOx during the interim processes, this change effectively managed to extract additional density from the denser packing of the trenches. June 18, at Enabling Cheaper Design Brian Bailey. November 18, No Comment. Process Corner Explosion At 7nm and below, modeling what will actually show up in silicon is a lot more complicated.

Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful. Memories play a […]. A poly strap i. As shown, the memory is embedded into the Centaur chip, but is off-chip from the Power8.

More Than a Core Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful. The Deep trench extends through the top silicon, through the oxide layer and into the base substrate. Newer Post Older Post Home.

Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely. Below is a cross-sectional SEM shot of the entire stack from the 40x power rails at the very top to the deep trench capacitors under the devices. December 25, 17 Comments. Power is not a substantial player in the Network Management world, so I would not really expect edfam to tune the CPU for this type of workload. Haswell package layout diagram [3], [4]. There, the fin switches from mono-Si to poly-Si which forms the connection to the DT capacitor.

One thing that should be stated upfront is ubm Haswell and Power8 are targeting different parts of the market. DTs are traditionally created by etching an opening in the hardmask or alike layer. David February 23, at 5: The use of Static RAM has been traditionally beneficial to the chip manufacturers, since they could get fast and regular access to the memory cells, without having to wait for a slow refresh signal to propagate across the RAM.

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The Power Of eDRAM

Every benefit comes with a drawbacks. GlobalFoundries 14HP boasts an ultra-dense 0. On the FinFET, the strap is formed where the base of the fin lands at deep trench. Clearly, this is more efficient than having to go off-package but not as efficient as staying on-chip. If so maybe in zen 2? Trending Articles Fundamental Shifts In This will go down as a good year for the semiconductor industry, where new markets and innovation were both necessary and rewarded.

With multi-process heavy workloads, where data in the cache may not be simultaneously accessed from different cores or hardware strands, eDRAM may be a good fit.

Network Management: IBM Power 7 and eDRAM Cache

There are also a lot of other factors that come into rdram when evaluating DRAM, such as performance and data retention, but this at least provides a quick high-level comparison. Finally a liner is applied after which the trench is filled with the highly-doped probably arsenic-doped silica glass ASGn-type polycrystalline silicon. Power Delivery Affecting Performance At 7nm Slowdown due to impact on timing, and dependencies between power, thermal and timing that may not be caught by signoff tools.

Network Management does ibbm long term storage requirements of data, so this may be a very good back-end platform. November 11, 1 Comment. AMD has the volume to use this tech.